Conference Title
IEEE International Interconnect Technology Conference (IITC 2019) and the Materials for Advanced Metallization Conference (MAM 2019)
Conference Dates
03 - 06 Jun 2019
Submission Deadline
01 Feb 2019 ( Submission is open )
Indexes
Unknown
Official Web Site
Venue
RADISSON BLU ROYAL HOTEL BRUSSELS
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248
Location
Brussels, Belgium    
Map: City  Metro  
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Eat: Recommanded by the Brussels tourist office  by Google 

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Description
IEEE International Interconnect Technology Conference (IITC 2019) and the Materials for Advanced Metallization Conference (MAM 2019) will be held at the Radisson Blu Royal Hotel, Brussels, Belgium, June 3 - 6, 2019.

The 22nd edition of IITC is sponsored by the IEEE Electron Devices Society as the premier conference for interconnect technology devoted of advanced metallization and 3D integration for ULSI IC applications. Starting as a workshop on refractory metals and silicides in the 1980’s and moving towards advanced metallization in 1995, the 28th edition of MAM is devoted to research on materials properties and interactions of interconnect and silicide materials. These two conferences will be combined again in 2019 for the 3rd joint IITC-MAM conference.

This year’s conference will be held in Brussels, Belgium at the heart of Europe. The conference location is easily accessible from the national airport and central station. It is close to the Grand Place / Grote Markt at the center of Brussels, where history, art, culture, architecture, culinary delights meet.

The program for the 2019 meeting will be available in March 2019. Keynote presentations and invited talks will be given by scientific and technical leaders in each of the key areas to present the current state-of-the-art and to stimulate technical discussions. Watch out for news on invited speakers. To see the 2018 Program click here.
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