Conference Title
CSMO 2018 (2nd International Conference on Simulation, Modeling and Optimization (CSMO 2018))
Conference Dates
25 - 27 May 2018
Submission Deadline
Unknown
Indexes
Unknown
Official Web Site
Venue
Unknown
Views
1193
Location
Shanghai, China    
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Description
2nd International Conference on Simulation, Modeling and Optimization (CSMO 2018) will be starting on 25 May and finishing on 27 May 2018. CSMO 2018 will be in Shanghai, China but the venue of the event is not determined yet. With a considerable program covering a extensive array of matters such as Artificial Intelligence, Computer Engineering, Biomedical Engineering, Chemical Engineering and Statistics, CSMO 2018 will be totally a must-attend event. 2nd International Conference on Simulation, Modeling and Optimization (CSMO 2018) is organized annually. The professional congress organizer of the CSMO 2018, 2nd International Conference on Simulation, Modeling and Optimization (CSMO 2018) is 3rd Asia Conference on Power and Electrical Engineering (ACPEE 2018). Let Shanghai must do visitor attractions make you adore this city when you are there for CSMO 2018. Here are the great things you can do in Shanghai! Call for paper 2018 2nd International Conference on Simulation, Modeling and Optimization (CSMO 2018) May.25-27, 2018|Shanghai,China Web: http://www.csmo2018.org/ 2018 2nd International Conference on Simulation, Modeling and Optimization (CSMO 2018) will be held in Shanghai, China during May 25-27, 2018. CSMO 2018 is a not-to-be-missed opportunity that distills the most current knowledge on a rapidly advancing discipline in one conference. Join key researchers and established professionals in the field of Simulation, Modeling and Optimization as they assess the current state-of-the-art and roadmap crucial areas for future research. ?Publication and Indexing All the accepted papers will be published on Conference Proceeding, which will be indexed by Ei Compendex, CPCI, Scopus, IET and other academical databases. Selected papers with great extension will be recommended to publish in international journals.
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